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深圳市鴻明精密電路有限公司
79.包裝及出貨:Packing& shipping
80.清洗及烘烤: Final Clean & Baking
81.銅面保護(hù)劑:ENTEK Cu-106A/OSP
82.離子殘余量測(cè)試:Ionic Contamination Test/ Cleanliness Test
83.冷熱沖擊試驗(yàn):Thermal cycling Testing
84.焊錫性試驗(yàn):Solderability Testing
85.雷射鉆孔:Laser Ablation
86.雷射鉆Tooling孔:Laser ablationTooling Hole
87.雷射曝光對(duì)位孔:Laser Ablation Registration Hole
88.雷射Mask制作:Laser Mask
89.雷射鉆孔:Laser Ablation
90.AOI檢查及VRS:AOI Inspection & Verified & Repaired
91.除膠渣:Desmear
92.專用治具測(cè)試:Dedicated Tester
93.飛針測(cè)試:Flying Probe
94.壓板翹: Warpage Remove
95.底片:Ablation
96.燒溶:laser)
97.切/磨:abrade
98.粗化:abrasion
99.耐磨性:absorption resistance