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50.化學(xué)前處理,化學(xué)研磨:Chemical Milling
51.選擇性浸金壓膜:Selective Gold Dry Film Lamination
52.鍍金:Gold plating
53.噴錫:Hot Air SolderLeveling
54.成型:Profile/Form
55.開(kāi)短路測(cè)試:Electrical Testing
56.終檢:Final VisualInspection
57.金手指鍍鎳金:Gold Finger
58.電鍍軟金:Soft Ni/Au Plating
59.浸鎳金:Immersion Ni/Au / Electroless Ni/Au
60.噴錫:Hot Air Solder Leveling
61.水平噴錫:HorizontalHot Air Solder Leveling
62.垂直噴錫: Vertical Hot Air Solder Leveling
63.超級(jí)焊錫:Super Solder
64.印焊錫突點(diǎn):Solder Bump
65.數(shù)控銑/鑼板:N/C Routing/Milling
66.模具沖/啤板:Punch
67.板面清洗烘烤:Cleaning & Backing
68.V型槽/V-CUT: V-Cut/V-Scoring
69.金手指斜邊:Beveling of G/F
70.短斷路測(cè)試Electrical Testing/Continuity & Insulation Testing
71.AOI 光學(xué)檢查:AOI Inspection
72:VRS 目檢:Verified & Repaired
73.泛用型治具測(cè)試:Universal Tester
74.專(zhuān)用治具測(cè)試:Dedicated Tester
75.飛針測(cè)試:Flying Probe
76.終檢:Final Visual Inspection
77.壓板翹:Warpage Remove
78.X-OUT 印刷:X-Out Marking