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深圳市鴻明精密電路有限公司
18.迭板:Lay up
19.壓合:Lamination
20.后處理:Post Treatment
21.黑氧化:Black Oxide Removal
22.銑靶:spot face
23.去溢膠:resin flush removal
24.減銅:Copper Reduction
25.水平電鍍:HorizontalElectrolytic Plating
26.電鍍:Panel plating
27.錫鉛電鍍:Tin-Lead Plating /Pattern Plating
28.低于 1 mil: Less than 1 mil Thickness
29.高于 1 mil:More than 1 mil Thickness
30.砂帶研磨:Belt Sanding
31:剝錫鉛:Tin-Lead Stripping
32.微切片: Microsection
33.蝕銅:Etching
34.初檢:Touch-up
35.塞孔:Plug Hole
36.防焊(綠漆/綠油):SolderMask
37.C面印刷:Printing Top Side
38.S面印刷:Printing Bottom Side
39.靜電噴涂:Spray Coating
40.前處理:Pretreatment
41.預烤:Precure
42.后烘烤:Postcure
43.印刷:Ink Print
44.表面刷磨:Scrub
45.后烘烤:Postcure
46.UV烘烤:UV Cure
47.文字印刷:Printing of Legend
48.噴砂:Pumice/Wet Blasting
49.印可剝離防焊/藍膠:Peelable Solder Mask)